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Optical Critical Dimension Metrology Equipment
A non-contact optical metrology system for films, gratings, nanowires and periodic microstructures. Reflection and scattering signals are collected across wavelengths, incidence angles and polarization states, then analyzed through self-developed algorithms and numerical fitting.
Spectroscopic Ellipsometer
A precision optical instrument for universities, research institutes and industrial users. Ellipsometric parameters Psi and Delta are derived from the polarization change of reflected light, yielding film thickness, optical constants and multi-layer structures. Multi-angle, micro-area and automatic wafer Mapping configurations are available.
Wafer Micro-void Metrology Equipment
Metrology equipment for high aspect ratio micro-void arrays in advanced 3D stacking packaging and wafer fabrication. Angle-resolved scattering, white-light interferometry, reflection spectroscopy and confocal microscopy are integrated to characterize TSV critical dimensions, depth and topography.
About Seemic
Non-contact optical metrology
Non-imaging optical measurement that characterizes structures below the resolution limit of conventional optical imaging, without imaging the microstructure directly.
In-house algorithms and modeling
Self-developed fitting algorithms and numerical analysis, keeping memory footprint low and real-time computation modest.
Full process coverage
Metrology for advanced 3D NAND, advanced logic and advanced packaging processes, with specifications matching international leading levels.
Academic pedigree and industry experience
A team led by an academician of the Chinese Academy of Sciences, with members from Wuhan University, Hainan University and leading semiconductor experts, carrying more than 20 years of industry experience.
Semiconductor metrology experience
Granted invention patents
Metrology products in development
Hangzhou and Wuhan R&D
News
- 222026-10Four granted invention patents disclosed, covering defect detection, ANN modeling and nanostructure metrology
Four granted invention patents cover simplified test structure design for defect detection, ANN-based optical property modeling database generation, measurement model construction for stacked nanosheet structures, and co-packaged optoelectronic device fabrication.
- 182026-10POLARIS-F100 spectroscopic ellipsometer and TITAN-M100 wafer micro-void metrology equipment launched
The spectroscopic ellipsometer and wafer micro-void metrology equipment are launched together, completing product coverage across films, critical dimensions and high aspect ratio micro-voids.
- 102026-10AROSS-S100 angle-resolved scattering OCD metrology equipment launched
The non-contact angle-resolved scattering metrology equipment is launched for films, gratings, nanowires and periodic microstructures, characterizing parameters below the resolution limit of conventional optical imaging.
- 012026-09Seemic establishes its Wuhan R&D center
The company has set up an R&D center in Wuhan, forming a dual-site R&D layout together with the Hangzhou headquarters.
- 122026-08Team awarded first prize of the 2020 National Science and Technology Progress Award
The team received first prize of the 2020 National Science and Technology Progress Award in advanced packaging, an achievement that underpins the advanced packaging metrology line.