Products
Optical Critical Dimension Metrology Equipment
A non-contact optical metrology system for films, gratings, nanowires and periodic microstructures. Reflection and scattering signals are collected across wavelengths, incidence angles and polarization states, then analyzed through self-developed algorithms and numerical fitting.
Spectroscopic Ellipsometer
A precision optical instrument for universities, research institutes and industrial users. Ellipsometric parameters Psi and Delta are derived from the polarization change of reflected light, yielding film thickness, optical constants and multi-layer structures. Multi-angle, micro-area and automatic wafer Mapping configurations are available.
Wafer Micro-void Metrology Equipment
Metrology equipment for high aspect ratio micro-void arrays in advanced 3D stacking packaging and wafer fabrication. Angle-resolved scattering, white-light interferometry, reflection spectroscopy and confocal microscopy are integrated to characterize TSV critical dimensions, depth and topography.