
The core team of Seemic holds four granted invention patents in semiconductor metrology and advanced packaging, spanning simplified test structure design, algorithmic modelling and device fabrication. The original certificates are reproduced below.
1. Simplified test structure design method for defect detection systems

2. Method for generating an optical property modelling database based on ANN

3. Measurement model construction and measurement method for stacked nanosheet structures

4. Co-packaged optoelectronic device and method of preparing the same

The four applications were filed between 2020 and 2025, with Wuhan University as the patentee and the core technical team as the inventors. The portfolio covers defect detection structures, ANN based modelling database generation, measurement model construction for nanostructures, and co-packaged optoelectronic device fabrication, which is consistent with the company's current product line of non-contact optical metrology plus advanced packaging.
