Four granted invention patents disclosed, covering defect detection, ANN modeling and nanostructure metrology

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Four granted invention patents disclosed, covering defect detection, ANN modeling and nanostructure metrology

The core team of Seemic holds four granted invention patents in semiconductor metrology and advanced packaging, spanning simplified test structure design, algorithmic modelling and device fabrication. The original certificates are reproduced below.

1. Simplified test structure design method for defect detection systems

Invention patent certificate: simplified test structure design method for defect detection, No. 5114747
Certificate No. 5114747 · Patent ZL 2020 1 1573097.7 · Grant publication CN 112685889 B · granted 29 April 2022

2. Method for generating an optical property modelling database based on ANN

Invention patent certificate: ANN based optical property modelling database generation method, No. 6675932
Certificate No. 6675932 · Patent ZL 2020 1 1584307.2 · Grant publication CN 112699095 B · granted 2 February 2024

3. Measurement model construction and measurement method for stacked nanosheet structures

Invention patent certificate: measurement model construction for stacked nanosheet structures, No. 5588661
Certificate No. 5588661 · Patent ZL 2022 1 0154984.3 · Grant publication CN 114623777 B · granted 18 November 2022

4. Co-packaged optoelectronic device and method of preparing the same

Invention patent certificate: co-packaged optoelectronic device and preparation method, No. 8800573
Certificate No. 8800573 · Patent ZL 2025 1 0537879.1 · Grant publication CN 120469014 B · granted 24 March 2026

The four applications were filed between 2020 and 2025, with Wuhan University as the patentee and the core technical team as the inventors. The portfolio covers defect detection structures, ANN based modelling database generation, measurement model construction for nanostructures, and co-packaged optoelectronic device fabrication, which is consistent with the company's current product line of non-contact optical metrology plus advanced packaging.